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ZEISS Crossbeam Laser FIB-SEM  
for rapid failure analysis from transistors to packages
Dear Dan,

ZEISS introduces the new ZEISS Crossbeam laser FIB-SEM, a site-specific cross-section solution enabling faster package development and failure analysis.

Combined in the Crossbeam laser FIB-SEM is a femtosecond (fs)-laser for speed, Ga + beam for accuracy, and SEM for high resolution imaging to enable the fastest workflows. The isolated laser chamber prevents contamination of the electron column and detectors from ablated material, and sample integrity is promoted by avoiding exposure to atmosphere throughout the entire workflow.
Benefits of the Crossbeam fs-LaserFIB

Fastest access to site-specific buried features
The Crossbeam laser removes one cubic millimeter of Si with minimal artifacts in 30 minutes, compared to the days it would take other commonly used approaches. Integration of the laser and FIB into a single system and streamlined workflows provide the fastest results and a single instrument queue to manage.
Minimal to no artifacts and best specimen quality
Highest imaging performance with ablation contaminants segregated
Learn more.

Contact us if you would like more information or would like to speak with a member of our team.

Sincerely, 

ZEISS Process Control Solutions

W: www.zeiss.com/pcs
E: [email protected]
ZEISS Process Control Solutions (PCS)
4385 Hopyard Road
Pleasanton, CA 94588
USA
Visit ZEISS PCS Website